发明名称 Multilayer electronic component and multilayer electronic component manufacturing method
摘要 A multilayer electronic component and a multilayer electronic component manufacturing method are capable of easily controlling the degree of magnetic field coupling between inductors. Via-hole conductors are arranged so that they extend in a lamination direction in a laminate, and function as a first inductor. Via-hole conductors are arranged so that they extend in the lamination direction in the laminate, and function as a second inductor. A first capacitor and the first inductor define a first resonance circuit. A second capacitor and the second inductor define a second resonance circuit. The via-hole conductors are arranged in a first insulating layer so that they are spaced apart from each other by a first distance. The via-hole conductors are arranged in a second insulating layer so that they are spaced apart from each other by a second distance that is different from the first distance.
申请公布号 US8754724(B2) 申请公布日期 2014.06.17
申请号 US201213690036 申请日期 2012.11.30
申请人 Murata Manufacturing Co., Ltd. 发明人 Isoshima Tomoshiro
分类号 H03H7/09;H01P3/08 主分类号 H03H7/09
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. An electronic component comprising: a first resonance circuit including a first capacitor, a first conductor, and a second conductor; a second resonance circuit including a second capacitor, a third conductor, and a fourth conductor; wherein the first and third conductors are arranged to generate a first mutual inductance therebetween; the second and fourth conductors are arranged to generate a second mutual inductance therebetween; the first mutual inductance is different from the second mutual inductance; and the first conductor includes a first via-hole conductor and the second conductor includes a second via-hole conductor.
地址 Kyoto JP