Modular array and circuits for ultrasound transducers

摘要

Modular electronics are provided for a multi-dimensional array. The electronics are positioned perpendicular to the array in modules. The modules include frames to support the electronics and provide for electrical connection between the array and the electronics. The frames include thermally conductive material to transfer heat away from the electronics and the array. The frames form a surface to support part of the array and a single layer of flexible circuit material with pads and traces over the surface for electrical connection. The flexible circuit material allows connection to the electronics at a pitch different than the pitch of the array. The modules allow the same electronics parts to be used with different sized arrays. The traces and pads of the flexible circuit material may be changed for different arrays without having to redesign the electronics and/or modules.

主权项

1. An ultrasound transducer probe comprising:
a multi-dimensional array of ultrasound transducer elements; a plurality of frames stacked adjacent to the multi-dimensional array, each of the frames comprising metal structure extending from adjacent to the multi-dimensional array to a location spaced away from the multi-dimensional array and each of the frames supporting multiple of the ultrasound transducer elements of the multi-dimensional array; and a plurality of circuits connected with the transducer elements, the plurality of circuits connected with respective frames, the location being further away from the multi-dimensional array than the location is from the circuits wherein each of the frames comprises a support portion positioned adjacent to the multi-dimensional array, the support portion having a thickness corresponding to a number of rows of the ultrasound transducer elements connected with the circuit or circuits connected with the frame, and wherein each of the frames comprises a circuit portion narrower than the thickness, the circuit or circuits connected with the circuit portion such that the support portions of adjacent frames substantially abut each other.