Semiconductor device and method of manufacturing the same

摘要

According to one embodiment, a semiconductor device includes a switch element provided in a surface area of a semiconductor substrate, a contact plug with an upper surface and a lower surface, and a function element provided on the upper surface of the contact plug. The lower surface of the contact plug is connected to the switch element. The upper surface of the contact plug has a maximum roughness of 0.2 nm or less.

主权项

1. A method of manufacturing a semiconductor device, the method comprising:
forming a contact plug by forming a first metal material; and polishing the first metal material by a first CMP-process and a second CMP-process until a roughness of an upper surface of the contact plug becomes 0.2 nm or less, and wherein the second CMP-process is executed by using an acid-slurry comprising a colloidal silica, and the colloidal silica comprises silica particles.