Method for packaging target material and method for mounting target

摘要

It is an object to provide a method for packaging a target material with which a thin film that is less contaminated with an impurity in the air such as a compound containing a hydrogen atom can be formed. In addition, it is an object to provide a method for mounting a target with which a thin film that is less contaminated with an impurity can be formed. In order to achieve the objects, a target material in a target is not exposed to the air and kept sealed after being manufactured until a deposition apparatus on which the target is mounted is evacuated.

主权项

1. A packaged sputtering target comprising:
a backing plate including a mounting portion for a placement portion; a sintered body fixed to the backing plate; and a package attached to the backing plate so as to surround the sintered body without covering the mounting portion, wherein an inside of the package is filled with a gas having a dew point that is less than or equal to −40° C., wherein the sintered body comprises indium, gallium, and zinc, wherein the package includes a valve, and wherein the package comprises a metal plate, a metal foil, or a polymer film.