| 发明名称 | Device for treating wafers on assembly carriers | ||
| 摘要 | A device for treating wafers on assembly carriers is disclosed. A wafer to be treated can be fixed on a liquid film that is located between the front side of the wafer and the assembly carrier by freezing of the film. | ||
| 申请公布号 | US8753176(B2) | 申请公布日期 | 2014.06.17 |
| 申请号 | US201113035258 | 申请日期 | 2011.02.25 |
| 申请人 | Infineon Technologies AG | 发明人 | Kroeninger Werner;Schneegans Manfred |
| 分类号 | B24B47/10 | 主分类号 | B24B47/10 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A device for processing wafers, the device comprising: an assembly carrier; a dispenser for applying a liquid film to a region of the assembly carrier, the region including a peripheral zone of the assembly carrier and a central zone surrounded by the peripheral zone; and a temperature-controlling device adapted to control a temperature of at least the peripheral zone of the assembly carrier, wherein the temperature-controlling device is configured to change a state of the liquid film in the peripheral zone of the assembly carrier but not the central zone surrounded by the peripheral zone. | ||
| 地址 | Neubiberg DE | ||