| 摘要 |
The present invention relates to a multichip package. According to the present invention, chips are arranged such that one control IC chip and two MOSFFET chips are disposed in a small outline package (SOP) used as a surface mounting element and one control IC chip and three MOSFFET chips are disposed in a quad flat package (QFP). The control IC chips and the MOSFFET chips are mounted to lead frames corresponding thereto instead of one lead frame. Moreover, steps are formed in lead frames connected to the lead frame pads to which the chips are mounted and a fixed frame such that the lead frame pads are located below the lead frames and the fixed frame. According to the present invention, an in-use area of a PCB board to which the package is mounted can be reduced, and a thermal/electrical interference between the chips can be minimized due to use of the individual lead frames. Further, introduction of moisture into the molded package can be interrupted by the steps. |
