Discontinuous patterned bonds for semiconductor devices and associated systems and methods

摘要

Discontinuous bonds for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a first substrate and a second substrate, with at least one of the first substrate and the second substrate having a plurality of solid-state transducers. The second substrate can include a plurality of projections and a plurality of intermediate regions and can be bonded to the first substrate with a discontinuous bond. Individual solid-state transducers can be disposed at least partially within corresponding intermediate regions and the discontinuous bond can include bonding material bonding the individual solid-state transducers to blind ends of corresponding intermediate regions. Associated methods and systems of discontinuous bonds for semiconductor devices are disclosed herein.

主权项

1. A semiconductor device, comprising:
a first substrate; a second substrate having a plurality of projections and a plurality of recesses, with individual recesses bounded by neighboring projections and having a closed end, at least one of the first and second substrates having a plurality of solid-state transducers, wherein individual solid-state transducers are disposed at least partially within corresponding recesses, and wherein the projections are directly adjacent to the first substrate; and a discontinuous bond between the first substrate and the second substrate, the discontinuous bond comprising a bonding material bonded to the second substrate at the closed end of the recesses, with the solid-state transducers disposed between the first substrate and the bonding material.