| 摘要 |
<p>The present invention for a light emitting device package having a wide far field beam distribution, provides a light emitting device package comprising a lead frame; a light emitting device disposed on the lead frame; a molding material formed with an aperture which is connected to the lead frame and which can emit the light generated from the light emitting device; a protrusion which are arranged along at least a part of the periphery of the aperture of the molding material; and a filling material which covers the light emitting device, which fills the aperture to be concave on the part in where the light emitting device is disposed, and which connects the edge of the top of the filling material with the protrusion.</p> |
