| 摘要 |
The present invention relates to a flux supply tool to attach a solder ball to evenly apply flux to a position to which the solder ball adheres evenly. More specifically, the present invention relates to the flux supply tool to attach the solder ball capable of having a simple structure and evenly apply the flux to each part to which the solder ball adheres by including a plate with holes on the portions corresponding to the positions attached to the solder ball; and install flux application means on the plate and apply flux to a desired position by pushing the flux through the holes formed on the plate. |
