METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD MANUFACTURED BY THE SAME

摘要

The present invention relates to a method for manufacturing a printed circuit board and the printed circuit board manufactured thereby. The method includes the steps of: preparing a base substrate; forming an internal circuit structure on the base substrate; forming an insulation material which includes a via hole exposing the internal circuit structure on the base substrate; forming an external circuit structure which is electrically connected to the internal circuit structure through a via hole on the insulation material; forming a reinforcement part on an undercut part between the external circuit structure and the insulation material; and processing the surface of the external circuit structure.