| 摘要 |
PURPOSE: A singulation equipment and singulation method using of an optical signal are provided to increase the durability of a part by applying a noncontact wireless power temporally to perform align and a test process. CONSTITUTION: In a singulation equipment and singulation method using of an optical signal, a light receiving unit(22) receives an alignment optical signal which is generated from a light emitting unit which is installed in semiconductor package(10). A light emitting unit(21) turns on a test optical signal with the light receiving unit. An align controller(23) receives an optical signal and determines an align state. A test controller(25) determines the electrical operation state of the semiconductor package. A power supply unit(30) supplies a temporary power to the semiconductor package for aligning and testing. |
