| 摘要 |
<p>Spaces between electronic components are bonded with high reliability. The electronic component (1A) comprises an electrode unit (21) and a solder (22) formed on the electrode unit. The electrode unit (21) has conductive parts, for example, a barrier metal (21b) and a projection (21c) formed on the same, in which diffusion coefficients for components of the solder (22) are different from each other. The solder (22) is formed on the barrier metal (21b) and the projection (21c) of the electrode unit (21). When bonding with mating components, rupture of the bonding between components is suppressed by suppressing lateral diffusion of the components of the solder (22) from the upper surface of the electrode unit (21) by generating diffusion and reaction of the components of the solder (22) preferentially in the projection (21c).</p> |
