发明名称 FILM FORMATION APPARATUS FOR SEMICONDUCTOR PROCESS
摘要 A film formation method performs a supply cycle of sequentially supplying two kinds of reactive gases inside a vacuum container to form a thin film on the substrate. The method includes placing the substrate, including a depressed portion formed thereon, on a table, then adjusting a temperature of the substrate to a temperature at which a first reactive gas is adsorbed and condensed, then supplying the first reactive gas and thereby depositing a condensed substance of the first reactive gas on the substrate, then rotating the table, then partly vaporizing the condensed substance by supplying a heated gas to the substrate; and then supplying a second reactive gas in an activated state to the substrate and thereby causing the second reactive gas to react with the condensed substance.
申请公布号 KR101407112(B1) 申请公布日期 2014.06.13
申请号 KR20100084692 申请日期 2010.08.31
申请人 发明人
分类号 H01L21/205 主分类号 H01L21/205
代理机构 代理人
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