METHOD FOR PROCESSING A FLEXIBLE CUPPER CLAD LAMINATED FILM

摘要

The present invention relates to a semi-additive flexible copper clad laminated film and a method for manufacturing the same. The method for manufacturing the semi-additive flexible copper clad laminated film of the present invention capable of minimizing the generation of a pin hole includes: a step of increasing surface chemical active, surface cleaning, and roughness by performing a plasma process on a polyimide film in a vacuum atmosphere in order to ensure adhesive between the polyimide film and a metal; and a step of depositing a seed layer (Cu) on a tie layer (Ni-Cr alloy) functioning as a conductive layer deposited on a surface of a plasma processed nonconductive polyimide film at a thickness of 500Åto 1500Åusing a sputtering method, which is a physical vapor deposition (PVD) method. The method for manufacturing a semi-additive flexible copper clad laminated film capable of minimizing the generation of a pin hole significantly reduces the number of generated pin hole and prevents failures in a shape and a pattern by setting the thickness of a seed layer to a specific condition by depositing a tie layer functioning as a conductive layer on a surface of plasma processed nonconductive polyimide film using a sputtering method, which is the physical vapor deposition method so as to form a super fine circuit of the semi-additive flexible copper clad laminated film of a super fine pattern, thereby solving the conventional problem caused by the generation of the pin hole.