| 摘要 |
Provided is a device for forming an external electrode. The device for forming an external electrode on the outer surface of a chip component according to the present invention, includes: a carrier plate that has a first metal plate, in which a plurality of first opening holes having a constant size are formed through the first metal plate, and a first elastic layer that forms a supporting hole with a relatively smaller size than that of the first opening hole in the first opening hole, wherein a part of a body of the chip component is inserted into and fixed to the supporting hole; and a masking plate that has a second metal plate, in which a plurality of second opening holes corresponding to the first opening holes are formed through the second metal plate, and a second elastic layer, in which an arrangement groove is formed in one side surface such that the rest of the body of the chip component fixed to the supporting hole is inserted and arranged therein, has an electrode forming slit formed through the arrangement groove so as to expose a part of the outer side surface of the chip component to the outside, wherein the masking plate is laminated on the carrier plate. |
