Lamination plate for laminating module of smart card e.g. micro-SIM, has thermally insulating element to thermally protect microchip of module when plate body is heated and module is placed in position on lamination surface

摘要

The plate (40) has a plate body (53) including a thermally conductive lamination surface (54) and a cavity (56) opening into the lamination surface. A thermally insulating element (60) is placed in the bottom of the cavity so that a microchip of a module engaged in the cavity is thermally protected by the thermally insulating element when the plate body is heated and the module is placed in position on the lamination surface. The thermally insulating element is removably inserted at the bottom of the cavity. Independent claims are also included for the following: (1) a lamination unit (2) a method for manufacturing a lamination plate.