发明名称 LED ARRAY CHIP AND METHOD FOR MANUFACTURING THE SAME
摘要 The present invention relates to an LED array chip including an LED array in which a plurality of unit LED chips are arranged adjacent to each other and a coating layer formed on the LED array to fill a space between the unit LED chips while covering the top surface of the unit LED chips, and to a manufacturing method thereof. The LED array chip can form a surface light source with uniform luminance distribution.
申请公布号 KR20140071612(A) 申请公布日期 2014.06.12
申请号 KR20120139366 申请日期 2012.12.04
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 HWANG, SUNG KI
分类号 H01L33/48;H01L33/50 主分类号 H01L33/48
代理机构 代理人
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