| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure for embedding a semiconductor device and a method of embedding a semiconductor device, capable of preventing a resin for embedding the semiconductor device from being cracked without reducing a manufacturing efficiency.SOLUTION: A structure for embedding a semiconductor device comprises: a semiconductor device 30 having a semiconductor chip 32 therein; a resin 60 for embedding the semiconductor device 30; and a gas involving member 40 involving a gas and that is deformable under an external force. The gas involving member 40 is arranged between the semiconductor device 30 and the resin 60. The semiconductor device 30 may be formed in a plate shape, and the gas involving member 40 may be arranged at least one surface orthogonal to a thickness direction, of the semiconductor device 30. |
