发明名称 |
LIGHT-EMITTING DEVICE |
摘要 |
Improves light extraction efficiency. A light emitting device 1 using a white resin molding package 5 integrally molded with lead frames 3, 4 constituting an electrode corresponding to one or a plurality of light emitting element 2 and white resin, wherein an area in a plane view of a white resin surface on a reflective surface that is level with amounting surface of the light emitting element 2 is configured to be larger than total area in a plane view occupied by surfaces of the lead frames 3, 4 and the light emitting element. Further, a step section is formed on the surfaces of lead frames 3, 4, white resin is filled in the step section, and the area of white resin surface on a reflective surface where the light emitting element 2 is mounted is increased. |
申请公布号 |
US2014159076(A1) |
申请公布日期 |
2014.06.12 |
申请号 |
US201214236930 |
申请日期 |
2012.05.31 |
申请人 |
Sota Yoshiki;Ohta Masayuki;Tamaki Kazuo;Yamaguchi Shinji;Itoh Shin;Kimura Tomoshi;Tatsumi Masaki |
发明人 |
Sota Yoshiki;Ohta Masayuki;Tamaki Kazuo;Yamaguchi Shinji;Itoh Shin;Kimura Tomoshi;Tatsumi Masaki |
分类号 |
H01L33/50;H01L33/60;H01L33/62;H01L27/15 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
1. A light emitting device using a white resin molding package integrally molded with lead frames constituting electrodes corresponding to one or a plurality of light emitting element and white resin, wherein an area in a plane view of a white resin surface on a reflective surface that is level with amounting surface of the light emitting element is configured to be larger than an area in a plane view occupied by the lead frame surfaces and the light emitting element.
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地址 |
Osaka-shi JP |