发明名称 Structures and Methods to Enhance Copper Metallization
摘要 Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a metallization layer. The insulator includes a polymer or an insulating oxide compound. And, the inhibiting layer has a compound formed from a reaction between the polymer or insulating oxide compound and a transition metal, a representative metal, or a metalloid.
申请公布号 US2014159241(A1) 申请公布日期 2014.06.12
申请号 US201414183325 申请日期 2014.02.18
申请人 Taylor Jennifer J.;Micron Technology, Inc. 发明人 Farrar Paul A.
分类号 H01L23/532;H01L21/768 主分类号 H01L23/532
代理机构 代理人
主权项
地址 Spokane WA US