Material for Packaging Electronic Components

摘要

The invention provides a material for packaging of electronic components comprising a structured layer, wherein said structured layer comprises a mesh of cells, each cell comprising an electrically conductive rim and an electrically non conductive interior, said cells being interconnected so that any two adjacent cells share at least a portion of their respective rims.

主权项

1. A material for packaging of electronic components comprising a plurality of electrically conductive meandered rims meeting at a plurality of nodes, each meandered rim extending between two nodes such that a width of an amplitude of the meandered rim increases from one of the two nodes to a maximum and then decreases toward the other of the two nodes.