METHOD FOR MANUFACTURING ELASTIC WAVE DEVICE, AND ELASTIC WAVE DEVICE

摘要

Provided is a method for manufacturing an elastic wave device whereby short circuit defects and leak defects can be minimized. A plurality of functional element units (11) and a connection line (12) for electrically connecting the plurality of functional element units (11) are formed on one principal surface of a motherboard (10) having piezoelectric properties. A support layer (20) made of resin for enclosing the functional element units (11) is formed on the one principal surface of the motherboard (10). An elastic wave device (1) having the functional element units (11) is obtained by dividing the motherboard (10) and a laminate (35) having the functional elements (11) and the support layer (20) into a plurality of parts in accordance with a dicing line. The connection line (12) has a line main body (12a) positioned on the dicing line, and a connection unit (12b) in which the line main body (12a) and the functional element units (11) are electrically connected. Prior to dividing the laminate (35), a retaining member (21) made of resin which straddles the line main body (12a) is formed, separate from the support layer (20), in the width direction of the line main body (12a) on the motherboard (10).