发明名称 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a printed circuit board and a method for manufacturing the same.SOLUTION: A printed circuit board is presented including: a substrate having a patterned circuit layer formed on one surface thereof; and a resist pattern having a pattern corresponding to the circuit layer and covering the circuit layer so as to close the circuit layer. The width of the resist pattern covering an upper portion of the circuit layer is the same as that of the resist pattern covering a lower portion of the circuit layer. Also presented is a method for manufacturing the same.
申请公布号 JP2014110422(A) 申请公布日期 2014.06.12
申请号 JP20130231981 申请日期 2013.11.08
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 CHOI WOON CHUL;LEE HWAN SOO;CHA HE-YON
分类号 H05K3/28 主分类号 H05K3/28
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