发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 One processing block is arranged between an indexer block and another processing block. One substrate is transported to a main transport mechanism in the one processing block by a main transport mechanism in the indexer block, transported to a first processing section and a thermal processing section by the main transport mechanism in the one processing block and processing is performed on the substrate. The substrate after the processing is transported to the main transport mechanism in the indexer block by the main transport mechanism in the one processing block. Another substrate is transported to a sub-transport mechanism in a sub-transport chamber by the main transport mechanism in the indexer block, and is transported to a main transport mechanism in another processing block by the sub-transport mechanism in the sub-transport chamber. The substrate is transported to the sub-transport mechanism in the sub-transport chamber by the main transport mechanism in another processing block, and is transported to the main transport mechanism in the indexer block by the sub-transport mechanism in the sub-transport chamber.
申请公布号 US2014161983(A1) 申请公布日期 2014.06.12
申请号 US201314084067 申请日期 2013.11.19
申请人 INAGAKI Yukihiko 发明人 INAGAKI Yukihiko
分类号 B05B13/02;B08B3/04 主分类号 B05B13/02
代理机构 代理人
主权项 1. A substrate processing apparatus comprising: first, second and third processing regions; and a sub-transport region, wherein the second processing region is arranged between the first processing region and the third processing region, the first processing region includes a first main transport mechanism that transports a substrate, the second processing region includes a first processing section that performs processing on the substrate and a second main transport mechanism that transports the substrate, the third processing region includes a third main transport mechanism that transports the substrate, the sub-transport region includes a sub-transport mechanism that transports the substrate, the second main transport mechanism is configured to transport the substrate between the first main transport mechanism and the first processing section, and the sub-transport mechanism is configured to transport the substrate from the first main transport mechanism to the third main transport mechanism and to transport the substrate from the third main transport mechanism to the first main transport mechanism.
地址 Kyoto-shi JP