METAL LAYER HAVING RESIN LAYER ATTACHED THERETO, LAMINATED BODY, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

摘要

A metal layer (1) for a circuit board, said metal layer having a resin layer attached thereto, is provided with a resin layer (11), and a metal layer (12) that is provided on the resin layer (11). The resin layer (11) has thermosetting properties. The storage elastic modulus (E'RT) of the resin layer (11) at a temperature of 25°C, after the resin layer (11) is thermally cured at a temperature of 190°C in two hours, is not lower than 0.1 GPa but not higher than 1.5 GPa. Furthermore, the storage elastic modulus (E'HT) of the resin layer (11) at a temperature of 175°C, after the resin layer (11) is thermally cured at a temperature of 190°C in two hours, is not lower than 10 MPa but not higher than 0.7 GPa.