SEMICONDUCTOR WAFER MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer manufacturing method which can easily form an orientation flat line and perform beveling without any difficulty.SOLUTION: A manufacturing method of a semiconductor wafer 12 according to the present embodiment is a manufacturing method of a semiconductor wafer of cutting a plurality of small-diameter wafers 12 from a large-diameter semiconductor wafer 10 and comprises: a marking process of collectively forming a straight groove-like orientation flat line 16 every row by laser beams in a manner such that cutting positions of the small-diameter wafers line in a particular direction and each orientation flat line 16 traverses the small-diameter wafers 12 in each row in the large-diameter semiconductor wafer 10; and a cutting process of individually cutting the small-diameter wafers 12 from the large-diameter semiconductor wafer 10 by the laser beams after the marking process.