发明名称 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve the flatness of a substrate main surface after surface treatment with an easy method.SOLUTION: The invention relates to a method in which a process liquid T is dropped on a main surface of a substrate W from a process liquid drop nozzle 81 while the substrate W is rotated being horizontally held on a rotation stage 71 and surface treatment is performed on the entire main surface of the substrate W. The substrate W is pre-heated by a substrate temperature control mechanism 6 before the process liquid T is dropped and a temperature of the main surface of the substrate W is controlled to a predetermined temperature.
申请公布号 JP2014110319(A) 申请公布日期 2014.06.12
申请号 JP20120263944 申请日期 2012.12.03
申请人 TAZMO CO LTD 发明人 NAKAMURA OSAMU;NAKAHARA TAKAO
分类号 H01L21/306;H01L21/304 主分类号 H01L21/306
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