发明名称 RESIST COMPOSITION FOR EUV, METHOD OF PRODUCING RESIST COMPOSITION FOR EUV, AND METHOD OF FORMING RESIST PATTERN
摘要 A resist composition for EUV exhibiting E0KrF greater than E0EUV, in which E0KrF is a sensitivity to KrF light of 248 nm, and E0EUV is a sensitivity to EUV light, and a method of producing a resist composition for EUV including preparing the resist composition so that E0KrF is greater than E0EUV, and a method of forming a resist pattern, including applying the resist composition for EUV to a substrate to form a resist film on the substrate; conducting EUV exposure of the resist film; and developing the resist film to form a resist pattern. The resulting resist composition for EUV exhibits excellent lithography properties and pattern shape in EUV lithograph.
申请公布号 US2014162193(A1) 申请公布日期 2014.06.12
申请号 US201414177808 申请日期 2014.02.11
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 Iwashita Jun;Konno Kenri
分类号 G03F7/20 主分类号 G03F7/20
代理机构 代理人
主权项 1. A method of forming a resist pattern, comprising: applying a resist composition to a substrate to form a resist film on the substrate, the resist composition exhibiting E0KrF greater E0EUV, wherein E0KrF is a sensitivity to KrF light of 248 nm, and E0EUV is a sensitivity to EUV light; conducting EUV exposure of the resist film; and developing the resist film to form a resist pattern.
地址 Kawasaki-shi JP