发明名称 |
RESIST COMPOSITION FOR EUV, METHOD OF PRODUCING RESIST COMPOSITION FOR EUV, AND METHOD OF FORMING RESIST PATTERN |
摘要 |
A resist composition for EUV exhibiting E0KrF greater than E0EUV, in which E0KrF is a sensitivity to KrF light of 248 nm, and E0EUV is a sensitivity to EUV light, and a method of producing a resist composition for EUV including preparing the resist composition so that E0KrF is greater than E0EUV, and a method of forming a resist pattern, including applying the resist composition for EUV to a substrate to form a resist film on the substrate; conducting EUV exposure of the resist film; and developing the resist film to form a resist pattern. The resulting resist composition for EUV exhibits excellent lithography properties and pattern shape in EUV lithograph. |
申请公布号 |
US2014162193(A1) |
申请公布日期 |
2014.06.12 |
申请号 |
US201414177808 |
申请日期 |
2014.02.11 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
Iwashita Jun;Konno Kenri |
分类号 |
G03F7/20 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a resist pattern, comprising:
applying a resist composition to a substrate to form a resist film on the substrate, the resist composition exhibiting E0KrF greater E0EUV, wherein E0KrF is a sensitivity to KrF light of 248 nm, and E0EUV is a sensitivity to EUV light; conducting EUV exposure of the resist film; and developing the resist film to form a resist pattern.
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地址 |
Kawasaki-shi JP |