| 发明名称 |
Multi-Layered Ceramic Capacitor with Soft Leaded Module |
| 摘要 |
An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp. |
| 申请公布号 |
US2014160624(A1) |
申请公布日期 |
2014.06.12 |
| 申请号 |
US201314096605 |
申请日期 |
2013.12.04 |
| 申请人 |
Kemet Electronics Corporation |
发明人 |
McConnell John E.;Webster Alan P.;Jones Lonnie G.;Renner Garry L.;Bell Jeffrey W. |
| 分类号 |
H01G4/30;H01G4/008 |
主分类号 |
H01G4/30 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A capacitor comprising at least one MLCC sandwiched between a first lead and a second lead wherein each of said first lead and said second lead comprises at least one first integral lead crimp.
|
| 地址 |
Simpsonville SC US |
