发明名称 |
AU-SN-BI ALLOY POWDER PASTE, AU-SN-BI ALLOY THIN FILM, AND METHOD FOR FORMING AU-SN-BI ALLOY THIN FILM |
摘要 |
The present invention provides a Au-Sn-Bi alloy thin film which is uniform and thin while maintaining good bonding performance as a bonding layer using an Au-Sn-Bi alloy on a metalized layer on a substrate or an LED element. In the present invention, using an Au-Sn-Bi alloy powder paste obtained by mixing 15 to 30 wt% of RA flux and an Au-Sn-Bi alloy powder having a grain diameter no greater than 10 μm and having a composition containing 20 to 25 wt% of Sn and 0.1 to 5.0 wt% Bi, with the remainder made up of Au, screen-printing is performed on a predetermined region on an Au metalized layer. Next, the Au-Sn-Bi alloy powder is melted by heating and then solidified. An An-Sn-Bi alloy thin film having a thickness no greater than 5 μm and being provided with at least a eutectic structure is thereby formed. |
申请公布号 |
WO2014087896(A1) |
申请公布日期 |
2014.06.12 |
申请号 |
WO2013JP81901 |
申请日期 |
2013.11.27 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
ISHIKAWA MASAYUKI;YAMAMOTO YOSHIFUMI |
分类号 |
B23K35/22;B22F1/00;B22F9/08;B23K1/00;B23K1/20;B23K3/06;B23K35/30;B23K101/42;C22C5/02 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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