| 摘要 |
<p>Soldering device for selective soldering comprises a soldering bath for holding molten solder, at least one soldering nozzle, a soldering pump for pumping solder from the solder bath through the soldering nozzle, a movement means for relatively moving the soldering nozzle and a component, which is to be soldered, within the soldering area, and a feeding device for supplying the component, which is to be soldered, on soldering area. Many soldering nozzles are provided in many soldering nozzle arrangement. Each soldering nozzle arrangement comprises at least one soldering nozzle. Soldering device for selective soldering comprises a soldering bath for holding molten solder, at least one soldering nozzle, a soldering pump for pumping solder from the solder bath through the soldering nozzle, a movement means for relatively moving the soldering nozzle and a component, which is to be soldered, within the soldering area, and a feeding device for supplying the component, which is to be soldered, on soldering area. Many soldering nozzles are provided in many soldering nozzle arrangement. Each soldering nozzle arrangement comprises at least one soldering nozzle. The soldering area is associated with each soldering nozzle arrangement. The feeding device is designed for supplying the component in many soldering areas. The conveying paths of the individual components branches out such that each soldering area is supplied with the arrangement and withdrawn from the arrangement regardless of the other soldering areas. An independent claim is also included for selective soldering comprising carrying out soldering program for simultaneous soldering of many components, where many soldering nozzle arrangement are moved in a X-Y plane synchronously relative to each component with the movement means.</p> |
