COMPONENT EMBEDDED PRINTING CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To inhibit formation of voids between a surface of an electronic element and an insulating material by embedding the electronic element coated by forming a coating layer on the surface of the electronic element, before inserting the electronic element into a cavity, with an insulating material having the same physical properties as the insulating material packed in between the electronic component element and the cavity.SOLUTION: An electronic component embedded printed circuit board includes a core having a cavity; an electronic component inserted in the cavity and having a bonding coating layer on an outer peripheral surface; insulating layers laminated on and under the core and in contact with the bonding coating layer; and circuit patterns provided on the insulating layers.