LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

摘要

Disclosed are a laser machining apparatus and a laser machining method. The disclosed laser machining apparatus, which performs a laser machining work by irradiating a substrate with a machining beam, includes a laser machining unit including a first height measuring unit for measuring a surface height of the substrate by irradiating the substrate with a first measuring beam; and at least one second height measuring unit spaced apart from the laser machining unit to measure a surface height of the substrate by irradiating the substrate with a second measuring beam.