WIRELESS DEVICE

摘要

According to one embodiment, a wireless device is provided with a semiconductor chip, a substrate, an antenna, and a sealing material. The chip includes a wireless circuit. The substrate has a plurality of terminals arranged on a first surface and the chip arranged on a second surface. The antenna includes a radiation element and is electrically connected to the chip. The sealing material seals the chip and the antenna. A distance between a first wall of the sealing material substantially parallel to the second surface and the radiation element is equal to or more than a distance between a second wall of the sealing material substantially perpendicular to the second surface and the radiation element.

主权项

1. A wireless device comprising:
a semiconductor chip including a wireless circuit; a substrate having a plurality of terminals arranged on a first surface thereof and the semiconductor chip arranged on a second surface thereof that is different from the first surface; an antenna including a radiation element and electrically connected to the semiconductor chip; and a sealing material that seals the semiconductor chip and the antenna, wherein a distance between a first wall of the sealing material substantially parallel to the second surface of the substrate and the radiation element is equal to or more than a distance between a second wall of the sealing material substantially perpendicular to the second surface of the substrate and the radiation element.