| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board in which disconnection is rarely generated on an extraction wire in an opening on a solder resist layer.SOLUTION: A wiring board 10 consists of an insulation substrate 1 having a mounting part 1a where a semiconductor element S is mounted on its upper surface center; a number of semiconductor element connection pads 5 arranged parallel to each other along an outer periphery of the semiconductor element S on an outer periphery of the mounting part 1a on the insulation substrate 1; an extraction wire 6 extending from semiconductor element connection pads 5 to the center side of the mounting part 1a on the insulation substrate 1; and a solder resist layer 3 applied to the upper surface of the insulation substrate 1 and having an opening 3a which exposes the semiconductor element connection pads 5 and in which its inner peripheral side 3ai gets across the extraction wire 6. The inner peripheral side 3ai has a wavy shape in which a part getting across the extraction wire 6 has a gradientθof 45 degrees or less with respect to a virtual line L connecting the part to the center of the mounting part 1a.</p> |
