Micro-Interconnects for Light-Emitting Diodes

摘要

The present disclosure provides a method of fabricating a light emitting diode (LED) package. The method includes bonding a plurality of separated light emitting diode (LED) dies to a substrate, wherein each of the plurality of separated LED dies includes an n-doped layer, a quantum well active layer, and a p-doped layer; depositing an isolation layer over the plurality of separated LED dies and the substrate; etching the isolation layer to form a plurality of via openings to expose portions of each LED die and portions of the substrate; forming electrical interconnects over the isolation layer and inside the plurality of via openings to electrically connect between one of the doped layers of each LED die and the substrate; and dicing the plurality of separated LED dies and the substrate into a plurality of LED packages.

主权项

1. A light-emitting diode (LED) device, comprising:
a substrate having a first side and a second side opposite the first side; a conductive element extending through the substrate from the first side to the second side; an LED die disposed over the first side of the substrate; an electrically-insulating layer disposed over the LED die, the electrically-insulating layer containing an opening; and an interconnect feature disposed over the substrate and partially over the LED die, wherein a first end of the interconnect feature is electrically coupled to the LED die through the opening of the electrically-insulating layer, and a second end of the interconnect feature is electrically coupled to the conductive element, the second end being opposite the first end.