LIGHT EMITTING DEVICE PACKAGES WITH IMPROVED HEAT TRANSFER

摘要

Packages containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed. In one embodiment, LED package can include a thermal element having improved solder reliability to improve heat dissipation capacity of the LED package. LED package can include a molded plastic body having one or more LEDs attached to one or more electrical elements. The LEDs can be connected to an upper surface of the thermal element. The thermal element can include a bottom surface which can extend further away in distance from a body of the LED package than a bottom surface of the electrical element. This configuration can result in an improved connection between the LED package and an external circuitry source, thereby increasing heat transfer ability of the LED package.

主权项

1. A light emitting device package, the package comprising:
a body comprising at least a portion of a thermal element and at least a portion of an electrical element, the electrical element contained between lateral sides of the body without extending beyond the lateral sides of the body; at least one light emitting device mounted on a top surface of the body; and both the thermal element and the electrical element extending from a bottom surface of the body wherein a bottom surface of the electrical element extends away from the body a first distance, and a bottom surface of the thermal element extends away from the body a second distance that is greater than the first distance.