| 摘要 |
The present invention relates to a non-contact type infrared temperature sensor module. The non-contact type infrared temperature sensor module is packaged by mounting an infrared temperature sensor and an application specific integrated circuit (ASIC) on a lead frame. To this end, the non-contact type infrared temperature sensor module includes a first mounting pad to which the infrared temperature sensor is mounted on the lead frame arranged on a base and a second mounting pad to which the ASIC is mounted on the lead frame, wherein the first and second mounting pads are separated from each other. A through hole is formed at a position where the first mounting pad is arranged on the base, and the first mounting pad is positioned on the bottom surface of the through hole of the base. Therefore, the non-contact type infrared temperature sensor module of the present invention quickly emits, to the outside, heat generated by the infrared temperature sensor through the first mounting pad exposed to the bottom surface of the through hole of the base. According to the present invention, integration, miniaturization and temperature measurement speed can be improved by removing all external environments except the infrared temperature sensor affecting temperature measurement. |
