| 摘要 |
PROBLEM TO BE SOLVED: To provide an organosilicon compound having a novel structure, which can be used in fields such as rubber parts, semiconductor encapsulation materials, adhesive agents, coatings and metal surface treatment agents.SOLUTION: An organosilicon compound has a group reacting with an inorganic filler and a mercapto group, the number of the mercapto group being at least over 1 per 1 silicon atom, and a group reacting with an inorganic filler having the boiling point at ordinary pressure of 100°C or higher of a product produced by a reaction with the inorganic filler. |
