THERMOSETTING RESIN COMPOSITIONS, RESIN FILMS IN B-STAGE, METAL FOILS, COPPER CLAD BOARDS AND MULTI LAYER BUILD-UP BOARDS

摘要

A thermosetting resin composition contains a liquid epoxy resin, a solid epoxy resin having a softening point of 125° C. or lower, an aromatic diamine compound including benzoate group and a main chain including polymethylene group, a solvent soluble polyimide resin having Tg of 200° C. or higher and a weight average molecular weight Mw of 50000 or smaller, and a phenoxy resin having Tg of 130° C. or higher. A total of amounts of the solvent soluble polyamide resin and the phenoxy resin is 15 weight parts or more and 150 weight parts or less, provided that 100 weight parts are assigned to a total of amounts of the liquid epoxy resin, the solid epoxy resin and the aromatic diamine compound.

主权项

1. A thermosetting resin composition comprising:
(a1) a liquid epoxy resin; (a2) a solid epoxy resin having a softening point of 125° C. or lower; (b) an aromatic diamine compound comprising benzoate group and a main chain comprising polymethylene group; (c) a solvent soluble polyimide resin having Tg of 200° C. or higher and a weight average molecular weight Mw of 50000 or smaller; and (d) a phenoxy resin having Tg of 130° C. or higher;wherein a total of contents of said solvent soluble polyamide resin and said phenoxy resin is 15 weight parts or more and 150 weight parts or less provided that 100 weight parts are assigned to a total of contents of said liquid epoxy resin, said solid epoxy resin and said aromatic diamine compound.