SEMICONDUCTOR PACKAGE AND METHOD FOR ROUTING THE PACKAGE

摘要

A semiconductor package having improved performance and reliability and a method of fabricating the same are provided. The semiconductor package includes a processing chip including a first pin at a first side to output a first signal, and a second pin at a second side to output a second signal different from the first signal, and a substrate having the processing chip thereon, the substrate including a first bump ball electrically connected to the first pin and a second bump ball electrically connected to the second pin, wherein the first bump ball and the second bump ball are adjacent at one of the first and second sides of the substrate.

主权项

1. A semiconductor package comprising:
a chip including a first pin at a first side of the chip to output a first signal, and a second pin at a second side of the chip to output a second signal different from the first signal; and a substrate having the chip thereon, the substrate including a first bump ball electrically connected to the first pin and a second bump ball electrically connected to the second pin, wherein the first bump ball and the second bump ball are adjacent at one of first and second sides of the substrate.