| 发明名称 |
ELECTRONIC COMPONENT HAVING A MOLDED COMPONENT HOUSING |
| 摘要 |
An electronic component having a molded component housing and an electrically conductive insert part embedded in the component housing for contacting a micro component, the insert part having an accommodating area for accommodating the micro component with a subarea, which is spaced apart from the micro component, for decoupling the micro component from material stresses of the component housing. A method for manufacturing an electronic component having a molded component housing, an electrically conductive insert part for contacting a micro component being embedded in the component housing, a subarea, which is spaced apart from the micro component, decoupling the micro component from material stresses of the component housing, during curing of the housing material, in an accommodating area for accommodating the micro component on the insert part. |
| 申请公布号 |
US2014158420(A1) |
申请公布日期 |
2014.06.12 |
| 申请号 |
US201314094272 |
申请日期 |
2013.12.02 |
| 申请人 |
HAISS Eberhard;ROJAHN Martin;TAGLIEBER Matthias;SCHRIMPF Thomas;LUDWIG Matthias;BLUM Andreas |
发明人 |
HAISS Eberhard;ROJAHN Martin;TAGLIEBER Matthias;SCHRIMPF Thomas;LUDWIG Matthias;BLUM Andreas |
| 分类号 |
H05K7/02;H05K13/00 |
主分类号 |
H05K7/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component, comprising:
a molded component housing; and an electrically conductive insert part embedded in the component housing for contacting a micro component, wherein the insert part has an accommodating area for accommodating the micro component with a subarea, which is spaced apart from the micro component, for decoupling the micro component from material stresses of the component housing.
|
| 地址 |
Jungingen DE |
