发明名称 TOUGHENED SOLDER FOR DOWNHOLE APPLICATIONS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME
摘要 <p>Disclosed herein is a solder composition comprising a metal or a metal alloy; and an electrically conductive high temperature polymeric composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy. Disclosed herein too is a method comprising mixing an electrically conductive high temperature polymeric composition with a metal or a metal alloy to form the solder composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy.</p>
申请公布号 WO2014088755(A1) 申请公布日期 2014.06.12
申请号 WO2013US69076 申请日期 2013.11.08
申请人 BAKER HUGHES INCORPORATED 发明人 GERRARD, DAVID, PETER;ROY, SAYANTAN
分类号 B23K35/363;B23K35/26 主分类号 B23K35/363
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