发明名称 |
TOUGHENED SOLDER FOR DOWNHOLE APPLICATIONS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME |
摘要 |
<p>Disclosed herein is a solder composition comprising a metal or a metal alloy; and an electrically conductive high temperature polymeric composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy. Disclosed herein too is a method comprising mixing an electrically conductive high temperature polymeric composition with a metal or a metal alloy to form the solder composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy.</p> |
申请公布号 |
WO2014088755(A1) |
申请公布日期 |
2014.06.12 |
申请号 |
WO2013US69076 |
申请日期 |
2013.11.08 |
申请人 |
BAKER HUGHES INCORPORATED |
发明人 |
GERRARD, DAVID, PETER;ROY, SAYANTAN |
分类号 |
B23K35/363;B23K35/26 |
主分类号 |
B23K35/363 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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