| 摘要 |
PROBLEM TO BE SOLVED: To stably manufacture an electronic component device including a columnar conductor, with a suppressed fall of the columnar conductor.SOLUTION: On an adhesion layer 20 disposed on a support 10, a conductor film 70a having an aperture 71 is provided. An electronic component 30 is provided on the adhesion layer 20 of the aperture 71, so that a columnar conductor 80 is erected on a conductive film 70a. From the above state, a pseudo wafer 50 is formed by coating the conductive film 70a, the electronic component 30 and the columnar conductor 80 with a resin composition layer 40. After the separation of the pseudo wafer 50 from the adhesion layer 20, the conductive film 70a of the pseudo wafer 50 is partially removed to form a conductive pattern 70. On the pseudo wafer 50 having the formed conductive pattern 70, a re-wiring layer is formed and dicing is performed to form the electronic component device. |
