发明名称 PEELING DEVICE, PEELING SYSTEM, AND PEELING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a peeling device, a peeling system, and a peeling method, for further efficiency of peeling process.SOLUTION: A peeling device of the embodiment includes: a first holding part; a second holding part; and a peeling induction part. The first holding part holds a first substrate of a layered substrate in which a first substrate and a second substrate are jointed. The second holding part holds the second substrate of the layered substrate, and moves the second substrate in a direction away from the plate face of the first substrate. The peeling induction part forms on the side face of the layered substrate a part that serves as a starting point for peeling off the second substrate from the first substrate. In addition, the peeling induction part includes a sharp material and a movement mechanism that moves the sharp material toward the side face in the second substrate which is closer to a joint part connecting the first and the second substrates, of the side faces of the layered substrate.
申请公布号 JP2014110387(A) 申请公布日期 2014.06.12
申请号 JP20120265401 申请日期 2012.12.04
申请人 TOKYO ELECTRON LTD 发明人 ITO MASANORI;HONDA MASARU;CHINJU TAKAYUKI
分类号 H01L21/683;H01L21/02 主分类号 H01L21/683
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