| 摘要 |
PROBLEM TO BE SOLVED: To reduce contamination of a processing substrate which is caused by fine particles in a small manufacturing apparatus.SOLUTION: A small semiconductor manufacturing apparatus 100 is provided with: a processing chamber 110 which processes a semiconductor wafer 131; and an apparatus front chamber 120 which carries in/out the semiconductor wafer 131 to/from the processing chamber 110. Further, an anti-pollution chamber 210, to which the semiconductor wafer 131 is carried in, is provided above the apparatus front chamber 120. Further, a drive chamber 220 which is separated from the anti-pollution chamber 210 in an airtight manner is provided below the apparatus front chamber 120. In the anti-pollution chamber 210, a placement base of the semiconductor wafer 131 and a transfer arm 123 which transfers the semiconductor wafer 131 to the processing chamber 110 are arranged adjacent to each other in a plane view. A gas is blown to the anti-pollution chamber 210 from the upper side to the lower side. |
