发明名称 CUTTING APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To prevent the occurrence of chipping and the occurrence of burrs when a resin sealing body is collectively cut by using a rotary blade.SOLUTION: In a state where a rotary blade 9 is rotated in one direction in which an outer circumference part of the rotary blade 9 can keep cutting from a surface (upper surface) of a substrate 2 being an uppermost layer toward the inside, a stage 8 is moved in the +X direction and the rotary blade 9 cuts the substrate 2. Subsequently, in the state where the outer circumference part of the rotary blade 9 can keep cutting from a surface (lower surface) of a sealing resin 4 being a lowermost layer toward the inside, the stage 8 is moved in the -X direction and the rotary blade 9 cuts the sealing resin 4. By these arrangements, the resin sealing body 1 having a double-layered structure comprising the substrate 2 and the sealing resin 4 is cut.
申请公布号 JP2014108491(A) 申请公布日期 2014.06.12
申请号 JP20120264409 申请日期 2012.12.03
申请人 TOWA CORP 发明人 NAKAGAWARA SHUJI;AMAKAWA TAKESHI
分类号 B24B27/06;B24B55/02;H01L21/301;H01L21/56 主分类号 B24B27/06
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