发明名称 MODULE SUBSTRATE FOR CONTACT TYPE IC CARD
摘要 <p>PROBLEM TO BE SOLVED: To provide an IC module for a contact type IC card having: a plurality of partitioned conductor surfaces for contact on one surface; and on the other surface, a through-hole electrode making a through-hole connection with the conductor surfaces; a connection pad for connecting an IC chip connection terminal; a wiring pattern connecting the through-hole electrode and the connection pad; and the IC chip under flip-chip connection, and in which the through-hole electrode 12 and the connection pad are connected with a shortest wiring pattern.SOLUTION: In an IC module for a contact type IC card, an IC chip 7 is installed so that an alignment direction of conductor surfaces for contact C1, C2, C3 and an alignment direction of terminals 5 for connecting the IC chip 7 are at right angles to each other. An antenna coil 13 is provided surrounding the IC chip 7.</p>
申请公布号 JP2014109843(A) 申请公布日期 2014.06.12
申请号 JP20120263006 申请日期 2012.11.30
申请人 TOPPAN PRINTING CO LTD 发明人 KATAOKA SHIN
分类号 G06K19/077;B42D25/305;G06K19/07;H01L23/12;H01L25/00 主分类号 G06K19/077
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