| 摘要 |
PROBLEM TO BE SOLVED: To provide a prober which conducts high frequency measurement and wafer level inspection of dynamic characteristics in a wafer, in which multiple chips having electrodes on both surfaces are formed, with high accuracy.SOLUTION: A prober includes: a wafer chuck 18 which holds a wafer W having electrodes on both surfaces and a conductive support surface 18a which may contact with the rear surface electrode of a chip; a moving rotation mechanism which moves and rotates the wafer chuck 18; a head stage 22 for holding a probe card 24 having a probe 25 which contacts with the surface electrode of the chip and connects the surface electrode with a terminal of a tester body 31; a stage member 50 having a conductive stage surface 50a which is formed so as to be arranged parallel with the support surface 18a and is electrically connected with the support surface 18a, the stage member 50 which may integrally move with the wafer chuck 18; and a spring pin 52 which is fixed to a position facing the stage member 50 and may electrically contact with the stage surface 50a at its tip. The rear surface electrode of the chip is electrically connected with the tester body 31 through the spring pin 52. |
