PROTECTIVE-MEMBRANE-FORMING FILM

摘要

This protective-membrane-forming film, which is used to form a protective membrane that protects a semiconductor chip, contains an acrylic polymer (A), a curable epoxy component (B), and a filler (C). Epoxy-group-containing monomers constitute no more than 8% of the total mass of the monomers constituting the acrylic polymer (A). The glass transition temperature of the acrylic polymer (A) is greater than or equal to−3°C, and at least one surface of the protective membrane obtained by curing this protective-membrane-forming film has a gloss value of at least 20 as measured in accordance with JIS Z 8741.